• Thermal conductivity well matched to silicon wafers. Resist to Heat shock (Can tolerate rapid heating and cooling.)
  • Minimized metal contamination. Particle generation suppressed by sintering aidless.
  • High Resistivity to Plasma and Fluoride corrosion.
  • High thermal conductivity and Heat Radiation, Excellent Thermal Uniformity.


  • LP-CVD
  • High T/C Diffusion
  • Thermal and Chemical Resistive
  • Etching Process

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