- Thermal conductivity well matched to silicon wafers. Resist to Heat shock (Can tolerate rapid heating and cooling.)
- Minimized metal contamination. Particle generation suppressed by sintering aidless.
- High Resistivity to Plasma and Fluoride corrosion.
- High thermal conductivity and Heat Radiation, Excellent Thermal Uniformity.
- High T/C Diffusion
- Thermal and Chemical Resistive
- Etching Process
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