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Sputtering Targets
PDFThe services for bonding and manufacturing backing-plates can also be provided.
- Material for Optical device
Ge+α(Bi, In...), GeSeTe, AgGeSbTe etc...
- Material for Magnetic record and HARD DISK
CoCrPt-SiO2, FePt, CoCrPt-O, etc...
- Material for Display
Si-α, Si3N4, Si3N4-Si, etc...
- Superconductor
YBa2Cu3Ox, Y2BaCuOx, NdBa2Cu3Ox, Nd4Ba2Cu2Ox, etc...
- Material for Ferroelectric Substance
La2O3, La2O3-Mox, HfO2, Y2O3, HfO2-Al2O3 etc...
- Material for Cells
LSM, SSC, LaNiO3, LSC-YSZ, Bi2Ru2O7, SSC-SDC etc...
ボンディング加工、バッキングプレートの製作も行います。